With the development of lightweight and miniaturization of the electronics, communications and transportation industries, the issue of heat dissipation with high energy density has become increasingly prominent. For example, electric vehicle inverter conversion, PLC chip cooling, high-power LED searchlight, are in a very small volume of tremendous heat. The traditional thermal materials, copper and aluminum difficult to meet the demand, and thermal conductivity, heat the best material silver is too high cost, can not be industrialized applications, so a skill to play the thermal conductivity of copper and aluminum products is the thermal performance The ideal material for solving high energy density heat dissipation.
The aluminum copper heat sink independently researched and developed by our company can simulate the thickness of the copper layer, the tooth height of the aluminum layer, the tooth width and the tooth gap through the numerical simulation calculation. Through the semi-molten rolling compounding process of the company, Copper aluminum heat sink. The main features are as follows:

1.    Copper aluminum heat sink fully exerts the thermal conductivity of the copper material, and derives the advantages of the heat from the heat source.
2.    fully exerts the advantages of good heat dissipation and light quality of aluminum, which not only realizes the miniaturization of high energy density, but also realizes the light weight of the heat dissipation system.
3.    Cu-Al metallurgical integration, and there is no contact between the copper and aluminum thermal resistance, reducing the heat transfer interface, play to improve the system's cooling efficiency.